The TECVAC, Inc. Processes are
a new generation of repair methods utilizing vacuum technology.
WIDELY PROVEN AROUND THE WORLD, TECVAC, Inc.LEADS
THE WAY IN PROVIDING THE DEEPEST LEVEL OF FILL TO THE NARROWEST
WIDTH OF CRACK..
Since development in the early 1970's, vacuum technology
has demonstrated its lasting superiority when applied to the repair of
concrete masonry and stone members. No conventional method of repair can
come close to its ability to penetrate defects right to the source of the
problem. Filling cracks as narrow as 0.002 inches is common place. Petrographic
reports have identified cracks filled as narrow as 5 microns.
The TECVACtm Processes
utilize the forces of nature to enhance their ability to manipulate repair material
to great depth
By applying negative forces to the disrepaired or damaged
area, inherent problems associated with conventional pressure methods are
totally eliminated. These powerful vacuum forces promote, rather than interfere,
with advancing the repair materials to the deepest and narrowest possible
levels of penetration. No method gets deeper than vacuum.
